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  1. Vias Under SMD

    ... Unary Summary Specifies whether vias can be placed under SMD pads during autorouting. Constraints ...

    admin - 02/27/2014 - 07:42

  2. Vias Under SMD

    ... Unary Summary Specifies whether vias can be placed under SMD pads during autorouting. Constraints ...

    admin - 09/13/2017 - 15:32

  3. Interactive Routing Improvements

    ... (demonstrated in the animated GIF below).   Via Under SMD Design Rule - this rule is obeyed during interactive routing, pads ... by an applicable Via Under SMD design rule can have vias placed in them. Routing Layers Design Rule - this rule is obeyed ...

    admin - 09/13/2017 - 15:32

  4. Interactive Routing Improvements

    ... (demonstrated in the animated GIF below).   Via Under SMD Design Rule - this rule is obeyed during interactive routing, pads ... by an applicable Via Under SMD design rule can have vias placed in them. Routing Layers Design Rule - this rule is obeyed ...

    jason.howie@alt... - 11/13/2014 - 17:27

  5. Internal Power and Split Planes

    ... the existing layer that you want the internal layer created under and press Add Plane . A new internal plane is added to the layer ... about board shapes.   Connecting Pads and Vias to a Power Plane Connections to pads and vias are displayed on a ...

    admin - 04/30/2014 - 12:52

  6. Internal Power and Split Planes

    ... the existing layer that you want the internal layer created under and press Add Plane . A new internal plane is added to the layer ... about board shapes.   Connecting Pads and Vias to a Power Plane Connections to pads and vias are displayed on a ...

    admin - 09/13/2017 - 15:32

  7. Fabrication and Assembly Testpoint Style

    ...  specify the allowable physical parameters of pads and vias that are to be considered for use as testpoints for bare-board fabrication ... either  Top ,  Bottom , or both. Allow Testpoint Under Component Use this option to enable the use of pads/vias located ...

    admin - 02/27/2014 - 06:37

  8. New Features in Altium Designer 14.0 - 14.3

    ... a via shield is created by placing one or more rows of vias alongside a signal route. Feature in-depth... ... edge of the unused pad shape. In some situations, such as under a BGA, this can recover a substantial amount of copper lost in polygons. ...

    admin - 09/13/2017 - 15:32

  9. What's New in Altium Designer

    ... of the connector and the case? just how much room is there under that display? These questions can now be answered by the new 3D ... Hole tolerance attributes can now be set in the Pads and Vias Properties dialogs. Additionally, when holes are shown in the drill table, ...

    admin - 11/29/2016 - 17:22

  10. Fabrication and Assembly Testpoint Style

    ...  specify the allowable physical parameters of pads and vias that are to be considered for use as testpoints for bare-board fabrication ... either  Top ,  Bottom , or both. Allow Testpoint Under Component Use this option to enable the use of pads/vias located ...

    admin - 09/13/2017 - 15:32

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